GearPop Blog

The Wii U’s announcement at E3 2012 was undeniably a bit underwhelming. In fact, some people still don’t realize it’s not an add-on for the original Wii. This and a number of other reasons has caused Nintendo’s Wii U to not sell the way they wanted it to. With most people identifying the Wii U as a failure, it’s no surprise Nintendo would want to move on, and with new rumors surfacing, that could be exactly what they’re doing.  News first surfaced on a website titled Nintendo News that one of their “very reputable sources” had intel on a new Nintendo console. Dubbed, “Fusion”, they are boasting specs that would blow Playstation 4 and the Xbox One out of the water.

The Fusion name comes from the fact that this console will consist of a home unit and a handheld, working in unison to bring you a unique gaming experience. The home unit, called the, “Fusion Terminal”, boasts these specs:

• GPGPU: Custom Radeon HD RX 200 GPU CODE NAMED LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
• CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODE NAMED JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
• Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODE NAMED HAMMER
• MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODE NAMED KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODE NAMED BARREL
• 802.11 b/g/n Wireless
• Bluetooth v4.0 BLE
• 2 USB 3.0
• 1 Coaxial Cable Input
• 1 Cable Card Slot
• 4 Custom Stream-Interface Nodes up to 4 Wii U Game Pads
• Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot
• 1 HDMI 2.0 1080p/4K Port
• Dolby TrueHD 5.1 or 7.1 Surround Sound
• Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
• Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Disk-less Version with 300 Gigs of Internal Flash Storage

The handheld which is believed to double as a controller for the home unit is dubbed, for now, the “Fusion DS”. The specs of which are:

• CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
• COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
• 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
• Slide Out Design with Custom Swivel Tilt Hinge
• Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
• Low End Vibration for Gameplay and App Alerts
• 2 Motorized Circle Pads for Haptic Feedback
• Thumbprint Security Scanner with Pulse Sensing Feedback
• 2 1mp Stereoptic Cameras
• Multi-Array Microphone
• A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
• 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
• NFC Reader
• 3G Chip with GPS Location
• Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
• 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigabytes)
• Nintendo 3DS Cart Slot
• SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
• Mini USB I/O
• 3300 mAh Li-Ion battery

So what do you think? Could Nintendo be prepared to pull the plug on it’s current system and bring a more hardware packed system to the table? With the big thing this generation seeming to be hardware, it could be true. With rumors speculating a 2015-2016 reveal, it will be quite a long wait. For now, we’ll just have to keep our eyes peeled for anything official from Nintendo themselves.

About the Author Joshua Oliver

Josh is an 18 year old Senior currently attending high school. Since he was a child he has been a huge techie and gamer. He has also never written for a public blog but has always been complimented on his writing in essays and projects. He is currently a Windows user but he does want to experiment with other operating systems such as OS X or Linux.

• 
•